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  • HOME
  • ABOUT
  • GLOBALFOUNDRIES
  • IP PORTFOLIO
  • DESIGN SERVICES
  • ASSEMBLY & TEST
  • SUCCESS STORIES
  • …  
    • HOME
    • ABOUT
    • GLOBALFOUNDRIES
    • IP PORTFOLIO
    • DESIGN SERVICES
    • ASSEMBLY & TEST
    • SUCCESS STORIES
    CONTACT
    • HOME
    • ABOUT
    • GLOBALFOUNDRIES
    • IP PORTFOLIO
    • DESIGN SERVICES
    • ASSEMBLY & TEST
    • SUCCESS STORIES
    • …  
      • HOME
      • ABOUT
      • GLOBALFOUNDRIES
      • IP PORTFOLIO
      • DESIGN SERVICES
      • ASSEMBLY & TEST
      • SUCCESS STORIES
      CONTACT
      • Beyond Electronics is a manufacturers' representative serving Fabless and IDM Chip Makers companies in Israel. Founded in 2013, we acts as an extension of our principals . Our end to end portfolio includes any  type of solutions to design and manufacture state of the art semiconductor SoCs and ASICs .  Our local technical sales people offer unique  expertise that is unparalleled in the Israel market. Beyond Electronics  also provides value add design services through strategic partnership with an ecosystem of partners in  Israel  and Europe.

         


         

      • Globalfoundries

        GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint.

        GF is redefining innovation and semiconductor manufacturing by developing feature-rich process technology solutions that provide leadership performance in pervasive high growth markets.

        As a steadfast partner, with a unique mix of design, development and fabrication services, GF works collaboratively alongside our customers to bring a broad range of innovative products to market. With a global customer base, a talented and diverse workforce and an at-scale manufacturing footprint spanning three continents, GF is delivering a new era of more.

      • IP PORTFOLIO

      • DESIGN SERVICES

      • UTAC

        Assembly and Test  (OSAT)

         

        UTAC is s one of the world's largest providers of outsourced (OSAT) semiconductor packaging, design, and test services. UTAC provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services.

      • SUCCESS STORIES

      • CONTACT US

        Don't be afraid to reach out. You + us = awesome.

        Derech Hareches 13
        Building C, 4th Floor
        Modiin Israel
        Modiin Technology Park
        Israel
        Sun-Thur 9h00-18h00
        +972-8-652-74-27
        +972-8-652-74-27
        info@beyond-electronics.com

      © 2021

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